密封胶伟德国际1946手机版

无硅导热膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅导热脂Thermal Compound TC70 7028328

时间:2015年03月04日 浏览:
分享到:
无硅导热膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅导热脂Thermal Compound TC70 7028328

产品编号:

产品型号:

产品材质:

产品价格:

会员价格:

库存数量:

计价单位:人民币

出品公司:

  • 无硅导热膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅导热脂Thermal Compound TC70 7028328

    tc70热物是一种独特的合成为基础的产品线热润滑脂具有优良的热传导性。他们是在用工业如电子产品(电脑,家电,无线,等),汽车,和电以确保快速,高效的传热和散热。初级
    这些非硅产品的优势是长期的材料稳定性。
    tc70化合物不浸,干燥,硬化,或熔体在正常工业用途。
    热化合物
    规格
    tc70 tc70-340wc tc70-57000财产
    320 340材料的一致性
    (渗透,
    工作,60X)
    比重2.7 2.7 n/a
    °C 25
    排0.1 0 0.5
    24小时。,% /体重在200 C 150 C°°°C 200
    蒸发量0.6 1 1
    24小时。,% /体重在200 C 150 C°°°C 200
    导热系数0.92 1.3 2.4
    36 W / m K°°C
    电气性能
    介电强度265 N / 305
    0.05“差距,V /军医
    介电常数5.02 N / 4.50
    °C 25,1000赫兹
    耗散因子0.0029 0.0022 n/a
    °C 25,1000赫兹
    体积电阻率为1.65×1014 20×1014 & lt;0.01
    欧姆厘米
    操作40 C 40 C°°°C 40
    温度范围为200℃到180℃°°°C 200
    外观平整,光滑,光滑
    白色糊白糊膏
    tc70 tc70-340wc包应用
    7028323 7028332 10cc的桶,25克用分配器
    7028324 7028333 10cc的桶,25克的应用手册
    7028325毫升75克7028334桶,用分配器
    7028326毫升75克7028335桶,手动应用
    7028336 55CC 7028327桶,100克用分配器
    7028328 7028337 6盎司盒,400克的分配阀
    7028329 7028338罐,1磅/ 450 g应用手册
    7028330 7028339桶,80磅/ 36.3公斤的大批量应用
    tc70-57000包应用
    7028341 10cc的桶,50克用分配器
    7028342瓶,1盎司/ 28克应用手册
    7028343罐,100克的应用手册
    7028344罐,1磅/ 454 g应用手册
    热复合
    选择
    tc70
    最广泛使用的非硅热复合。
    主要应用包括安装功率晶体管,
    功率电阻器,二极管和其他半导体器件,
    耦合热产生组件的底盘,传热
    介质对镇流器,热接头,热电偶,威尔斯,
    任何设备在有效的冷却是必需的。
    tc70-340wc
    非常适合应用在一个设备可能需要
    在以后的时间从散热片拆卸和清洗
    只有水。这种非硅热复合
    具有高导热性,优良的介电性能
    并将蔓延到一个非常薄的粘合线极低
    热电阻。
    tc70-57000
    一个优质的电气非硅热复合
    和热导率。主要的应用包括高
    电力电子器件如功率电阻器,
    二极管,晶体管和变压器;小功率电子
    应用如静态漏,接地,软性电子
    连接,散热,和组件的保护
    以及高功率电器的应用提高
    高功率开关和其他的运行效率
    滑动金属触点。

    Thermal Compounds
    TC70 thermal compounds are a product line of unique synthetic-based
    thermal greases with excellent thermal conductivity. They are used in industries
    such as electronics (computer, appliance, wireless, etc.), automotive, and
    electrical to ensure quick, efficient heat transfer and dissipation. The primary
    advantage of these non-silicone products is long-term material stability.
    TC70 compounds will not leach, dry, harden, or melt in normal industrial use.
    THERMAL COMPOUNDS
    Specifications
    Property TC70 TC70-340WC TC70-57000
    Consistency 320 340 250-350
    (Penetration,
    worked, 60x)
    Specific Gravity 2.7 2.7 N/A
    at 25°C
    Bleed 0.1 0 0.5
    24 Hrs., %/Weight at 200°C at 150°C at 200°C
    Evaporation 0.6 1 1
    24 Hrs., %/Weight at 200°C at 150°C at 200°C
    Thermal Conductivity 0.92 1.3 2.4
    36°C W/m °K
    Electrical Properties
    Dielectric strength 305 265 N/A
    0.05” gap, V/mil
    Dielectric constant 4.50 5.02 N/A
    25°C, 1,000 Hz
    Dissipation factor 0.0029 0.0022 N/A
    25°C, 1,000 Hz
    Volume Resistivity 1.65 x 1014 20.0 x 1014 < 0.01
    Ohm-cm
    Operating -40°C -40°C -40°C
    Temperature Range to 200°C to 180°C to 200°C
    Appearance Smooth, Smooth, Smooth
    Off-White Paste White Paste Paste
    TC70 TC70-340WC PACKAGE APPLICATION
    7028323 7028332 10cc barrel, 25 g For use with dispensers
    7028324 7028333 10cc barrel, 25 g For manual application
    7028325 7028334 30cc barrel, 75 g For use with dispensers
    7028326 7028335 30cc barrel, 75 g For manual application
    7028327 7028336 55cc barrel, 100 g For use with dispensers
    7028328 7028337 6 oz cartridge, 400 g For dispense valves
    7028329 7028338 jar, 1 lb / 450 g For manual application
    7028330 7028339 pail, 80 lb / 36.3 kg For high volume applications
    TC70-57000 PACKAGE APPLICATION
    7028341 10cc barrel, 50 g For use with dispensers
    7028342 jar, 1 oz / 28 g For manual application
    7028343 jar, 100 g For manual application
    7028344 jar, 1 lb / 454 g For manual application
    Thermal Compound
    Choices
    TC70
    The most widely used non-silicone thermal compound.
    Major applications include mounting power transistors,
    power resistors, diodes and other semiconductor devices,
    coupling heat generating assemblies to chassis, heat transfer
    medium on ballast, thermal joints, thermocouple wells, and
    for any device where efficient cooling is required.
    TC70-340WC
    Ideally suited for applications where a device may need to
    be removed from the heat sink at a later time and cleans
    up with only water. This non-silicone thermal compound
    has high thermal conductivity, excellent dielectric properties
    and will spread into a very thin bond line for extremely low
    thermal resistance.
    TC70-57000
    A non-silicone thermal compound with premium electrical
    and thermal conductivity. Major applications include high
    power electronic components such as power resistors,
    rectifiers, transistors and transformers; low power electronic
    applications such as static drain, grounding, soft electronic
    connections, heat dissipation, and assembly protection as
    well as high power electrical applications to improve the
    operational efficiency of high power switches and other
    sliding metal contacts.
  • 相关产品: